diff --git a/components.lbr b/components.lbr index de36df3..29b777b 100644 --- a/components.lbr +++ b/components.lbr @@ -1,14 +1,29 @@ - + + + + + + + + + + + + + + + + @@ -53,6 +68,7 @@ + @@ -73,7 +89,28 @@ + +<b>Ceramic Chip Capacitor KEMET 0603 reflow solder</b><p> +Metric Code Size 1608 + + + + +>NAME +>VALUE + + + + + +Ceramic Chip Capacitor KEMET 0603 reflow solder +Metric Code Size 1608 + + + + + >NAME @@ -102,7 +139,43 @@ + +<b>BLM18AG 601</b><p> +EMI Suppression Filter SMD0603 BLM18AG 600 Ohm +<br>Impedanz (100 MHz): 600 Ohm / ±25% +<br>Widerstand (DC) max.: 0,38 Ohm +<br>Nennstrom: 0,5 A + + + + + + + + + + + + + + + + + + + + +Since Version 8.3, EAGLE supports URNs for individual library +assets (packages, symbols, and devices). The URNs of those assets +will not be understood (or retained) with this version. + + +Since Version 8.3, EAGLE supports the association of 3D packages +with devices in libraries, schematics, and board files. Those 3D +packages will not be understood (or retained) with this version. + +